Intel’s 3D chip hailed as ‘next big thing’

A POTENTIALLY groundbreaking 3D microchip developed by engineers at Intel in a decade-long process is being hailed as “revolutionary” and could lead to generations of advances in computing.

In what is being seen as potentially the biggest breakthrough in microprocessor design in half a century, the company has found a way to mass produce its silicon transistors in three dimensions instead of two. This will ensure it can pack more power into its chips and may pave the way for the next generation of computing advances.

Microchip transistors, the key building blocks of electronics, up to now have been produced in flat structures. Intel’s latest advance allows it to make more complex three dimensional transistors on chips.