Intel renews €1.5m research partnership with Tyndall

Global computer giant Intel has renewed a $1.5m research partnership with the Tyndall National Institute, in Cork. They will develop the electronic devices of tomorrow.

Intel renews €1.5m research partnership with Tyndall

The partnership, between Tyndall researchers and Intel’s components research facility in Portland, Oregon, will involve scientists investigating next-generation tech materials, devices and photonics technologies, including high-density, super-powerful computer chips.

Under the terms of this latest deal — the third time it has been renewed since it was first signed, in 2009 — Intel will invest $1.5m between now and 2018 in the development of technology with Tyndall. It also provides Intel with a commercial exploitation licence for technology created with the Tyndall team.

Bernie Capraro, the research manager of Intel Ireland’s Silicon Technology division, hailed the Tyndall researchers’ work, and the institute’s focus on industry needs.

“We particularly appreciate Tyndall’s flexibility, because we do alter the research programme from year to year, depending on what needs we have and how our interests change,” he said. “We anticipate that Tyndall will continue to deliver on projects, and to adapt and be flexible, as they have done so far.

“We also hope that Tyndall will teach us about new concepts and possibilities. Often, Tyndall researchers bring solutions to Intel — rather than us coming to them with a problem, they will come to us with an opportunity, and we will evaluate whether it is something of interest that we could look at together.”

Tyndall’s CEO, Dr Kieran Drain, said the renewal of the Intel partnership is a major vote of confidence in the institute.

“Intel has world-class research partners on its doorstep in the western United States, so the fact that they would come thousands of miles to work with us, here at Tyndall, is reflective of our ability to offer a valuable alternative viewpoint,” he said.

“We are looking forward to continuing to work with Intel on major challenges, such as scaling, and examining new transistor architectures for high-density chips that can have a clear path to manufacturing with attractive economics.

“It requires new thought, and a new approach, to ensure that, as chips get smaller and more power- efficient, they also continue to get less expensive.”

The Tyndall National Institute, at UCC, is one of Europe’s leading information and communications technology research centres.

Its 460 researchers and engineers, and 125 graduate students, are engaged in research projects with over 200 industry partners.

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